Dual mode cooling system for use with in-wall video-codec and other electronic circuits

ABSTRACT

Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

CROSS REFERENCE TO RELATED APPLICATIONS

Related subject matter is disclosed in co-pending U.S. Non-provisionalpatent application Serial No. XX/YYY,ZZZ (Attorney Docket No.CP00565-01), co-filed on Jul. 6, 2022, and in co-pending U.S.Non-provisional patent application Serial No. XX/YYY,ZZZ (AttorneyDocket No. CP00565-02), co-filed on Jul. 6, 2022, the entire contents ofboth which are expressly incorporated herein by reference.

BACKGROUND Technical Field

Aspects of the embodiments described herein relate generally to coolingsystems, and more specifically to systems, methods, and modes for a dualmode cooling system for electronics with limited access to coolingsurfaces or ducts.

Background Art

The use of heat generating electronics confined to smaller and smallercompartments has grown substantially over the last several decades, asmicroprocessors and integrated circuits have increased in computingpower and speed, and shrunk in size. Such size shrinkage means that moredevices can be fit into a specific volume, with proportional andsometimes exponential increases in heat dissipation requirements. Onesuch category of electronic devices that have achieved substantialincreases of capabilities and heat generation are audio/video (AV)transmitter/receiver (transceiver) devices.

Such AV transceivers can be used in many different locations in anoffice or home, but one particularly demanding environment are thosethat are housed in gang boxes with faceplates that are secured withinthe walls of a house/building. Such AV transceivers gang boxes andfaceplates have been commonly used for many years. They started withanalog feedthrough connectors mounted on a faceplate that mounts to astandard gang-box installed in a wall. Coax cable was run through thewall and terminated to the plate. Users could then plug in their laptopor TV to these plates. As AV went digital it became difficult totransport the digital signals over long distances so circuits werecreated to convert the AV signals to a new format that can work overlong in-wall cables. These circuits had to be located inside the wallgang boxes. Wall gang boxes can be surrounded by the wall insulationtrapping heat. The only reliable path to remove heat is through thefront wall faceplate. FIG. 1 illustrates a typical AV installation inroom 100, and FIG. 2 is a sectional side view of a standard gang box(gang box) 104 and audio video circuitry housing (AVCH) 206 in internalwall 116.

Faceplate 102 covers gang box 104 and AVCH 206 that is located withininternal wall 116. Internal AV cable 106 carries the AV signal to AVcircuitry 118 that is housed within AVCH 206 located within gang box104, both of which, as those of skill in the art can appreciate, aresubstantially enclosed, and thus cannot dissipate excess heat into wallcavity 204 (FIG. 2 ) between walls 116 and 202. That is, AVCH 206 andgang box 104 is substantially adiabatic. External AV cable 108 carriesthe processed AV signal from AV circuitry 118 to AVreceiver/modem/amplifier (AV device) 110, which then outputs the same orthe further processed AV signal to AV display 112. AV device 110 can belocated on or in bureau 114, which is located in interior area 122.

Faceplates 102 have a limited surface area to transfer the heat outsideinternal wall 116. This is made worse by installing a common plastic“Decora” faceplate 102 that covers much of the metal mounting plate. Asvideo is being transported over cables 106, 108, the power consumptionof the integrated circuit (IC) devices used to convert the baseband AVsignals to a format compatible with these cables can exceed what can bedissipated by faceplate 102. The convertor ICs (AV circuitry 118) can bea dedicated conversion application specific IC (ASIC), fieldprogrammable gate array (FPGA), and/or a central processing unit (CPU)system on a chip (SoC). In addition, AV circuitry 118 can furthercomprise memory (e.g., but not limited to dynamic random access memory(DRAM) and Flash memory alongside the IC that may also be a heat sourceand requires cooling.

Even if AV circuitry 118 could be cooled by conduction to the faceplate102, it is important to not allow the exposed surfaces to get too hot totouch. Safety requirements such as UL/IEC 62368 define allowed touchtemperatures on product surfaces.

Accordingly, a need has arisen for systems, methods, and modes for adual mode cooling system for electronics with limited access to coolingsurfaces or ducts.

SUMMARY

It is an object of the embodiments to substantially solve at least theproblems and/or disadvantages discussed above, and to provide at leastone or more of the advantages described below.

It is therefore a general aspect of the embodiments to provide systems,methods, and modes for a dual mode cooling system for electronics withlimited access to cooling surfaces or ducts that will obviate orminimize problems of the type previously described.

This Summary is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. This Summary is not intended to identify key features oressential features of the claimed subject matter, nor is it intended tobe used to limit the scope of the claimed subject matter.

Further features and advantages of the aspects of the embodiments, aswell as the structure and operation of the various embodiments, aredescribed in detail below with reference to the accompanying drawings.It is noted that the aspects of the embodiments are not limited to thespecific embodiments described herein. Such embodiments are presentedherein for illustrative purposes only. Additional embodiments will beapparent to persons skilled in the relevant art(s) based on theteachings contained herein.

According to a first aspect of the embodiment, a dual mode coolingsystem is provided, comprising: electronic heat generating circuitry; aprinted circuit board upon which the electronic heat generatingcircuitry is located on a first side; a substantially adiabaticenclosure adapted to house the electronic heat generating circuitry,printed circuit board and other components of the dual mode coolingsystem; a finned heat sink adapted to be in thermal contact with theelectronic heat generating circuitry, the finned heat sink comprising aplurality of heat radiating fins; a faceplate adapted to enclose thesubstantially adiabatic enclosure and seal the substantially adiabaticenclosure against an interior wall, and wherein the faceplatecomprises—a cool air intake port adapted to receive cool air from anarea external to the substantially adiabatic enclosure and provide thecool air to an interior portion of the substantially adiabaticenclosure, and a heated air exhaust port adapted to exhaust heated airout of the enclosure into an area external to the enclosure; and a fanadapted to receive cool air from the cool air intake port and blow thecool air through the plurality of heat radiating fins of the finned heatsink to remove substantially all of the heat generated by the electronicheat generating circuitry via convection and generate heated air, andwherein the heated air is exhausted through the heated air exhaust portby the fan, and wherein an active cooling path comprises a path of airas it is received from the cool air intake, passes through the fan, overthe heated surface, and then is exhausted from the heated air exhaustport, and wherein the heated air exhaust port is separated with respectto the cool air intake port.

According to the first aspect of the embodiments, the heated air exhaustport is cater cornered with respect to the cool air intake port.

According to the first aspect of the embodiments, the dual mode coolingsystem further comprises: a first passive cooling path, comprising: afirst heat conducting device adapted to be in thermal contact with theelectronic heat generating circuitry and to accept heat generated by theelectronic heat generating circuitry; and a second heat conductingdevice adopted to be in thermal contact with the first heat conductingdevice and to accept heat conducted from the first heat conductingdevice and is further adapted to be compressible to form a thermaltransfer path between two objects, and wherein the faceplate is adaptedto be in thermal contact with the second heat conducting device and toaccept heat conducted from the second heat conducting device, and isfurther adapted to convectively transfer received heat from its surfaceto air surrounding the faceplate.

According to the first aspect of the embodiments, the dual mode coolingsystem further comprises: a second passive cooling path, comprising:electronic heat generating circuitry; the printed circuit board (PCB)upon which the electronic heat generating circuitry is located; one ormore through hole thermal vias located in the PCB that are each adaptedto be in thermal contact with the electronic heat generating circuitryand to accept heat generated by the electronic heat generatingcircuitry; and the finned heat sink located on the printed circuit boardadjacent to the vias, and which is adapted to be in thermal contact withthe one or more through hole thermal vias and to accept heat conductedfrom the one or more through hole thermal vias.

According to the first aspect of the embodiments, the dual mode coolingsystem further comprises: a third passive cooling path, comprising—theelectronic heat generating circuitry; and a fourth heat conductingdevice adapted to be in thermal contact with the electronic heatgenerating circuitry and the finned heat sink, and wherein the fourthheat conducting device is adapted to accept heat from the electronicheat generating circuitry and transfer the heat via conduction to thefinned heat sink.

According to the first aspect of the embodiments, the first passivecooling path further comprises: a third heat conducting device adaptedto be in thermal contact with the electronic heat generating circuitryand the first heat conducting device, and which is adapted to transferheat via conduction from the electronic heat generating circuitry to thefirst heat conducting device, and which is further adapted to becompressible to form a thermal transfer path between two devices.

According to the first aspect of the embodiments, the combination of thepassive cooling paths and active cooling path is adapted to removesubstantially all heat generated by the electronic heat generatingcircuitry from the substantially adiabatic enclosure into an area withinwhich the substantially adiabatic enclosure is located.

According to the first aspect of the embodiments, the combination of thepassive cooling paths is adapted to transfer heat to and through thefaceplate in such a manner that following the electronic heat generatingcircuitry being put into an inactive state and the fan being shut off,the active cooling path the faceplate convectively transfers heat awayfrom the interior of the substantially adiabatic enclosure through thefaceplate such that the faceplate remains at a temperature below anunsafe temperature.

According to the first aspect of the embodiments, the convectivetransfer of heat away from the faceplate and interior of thesubstantially adiabatic enclosure is such that the faceplate remains ata temperature below an unsafe temperature occurs through the conductivetransfer of heat to a first area of the faceplate.

According to the first aspect of the embodiments, the unsafe temperatureis about 70° C.

According to the first aspect of the embodiments, the dual mode coolingsystem further comprises: a baffle wall that separates an interior ofthe substantially adiabatic enclosure into a cool air baffle zone and aheated air baffle zone, such that substantially only cool air is locatedin the cool air baffle zone and substantially only heated air is locatedin the heated air baffle zone.

According to the first aspect of the embodiments, the dual mode coolingsystem further comprises: at least one or more holes in the printedcircuit board that allow cool air to flow from one side of the printedcircuit board to the other side of the printed circuit board in the coolair baffle zone; and at least one or more holes in the printed circuitboard that allow heated air to flow from one side of the printed circuitboard to the other side of the printed circuit board in the heated airbaffle zone.

According to the first aspect of the embodiments, the faceplatecomprises: at least one audio video signal connector.

According to the first aspect of the embodiments, the electronic heatgenerating circuitry comprises: audio-video processing circuitry.

According to the first aspect of the embodiments, the substantiallyadiabatic enclosure comprises: a standard gang box or wall mountedenclosure.

According to the first aspect of the embodiments, the standard gang boxcan be located within an insulated wall.

According to the first aspect of the embodiments, the dual mode coolingsystem further comprises: one or more through hole thermal vias locatedin the printed circuit board that are each adapted to be in thermalcontact with the electronic heat generating circuitry and to accept heatgenerated by the electronic heat generating circuitry and to transferthe same to the finned heat sink, the finned heat sink located on asecond side of the printed circuit board.

According to the first aspect of the embodiments, the cool air intakeport comprises—one or more holes in the faceplate formed at an angle αwith respect to a first imaginary line that is formed perpendicular toan outer surface of the faceplate, such that the cool intake air isingested into the substantially adiabatic enclosure from a firstdirection, and wherein the heated air exhaust port comprises—one or moreholes in the faceplate formed at an angle β with respect to a secondimaginary line that is formed perpendicular to the outer surface of thefaceplate such that the heated exhaust air is expelled away from thefaceplate in a second direction.

According to the first aspect of the embodiments, the angle α and theangle β are each about 0°.

According to the first aspect of the embodiments, the angle α is anacute angle and the angle β is about 0°.

According to the first aspect of the embodiments, the cool air intakeport formed at the angle α points away from the heated air exhaust portformed at the angle β.

According to the first aspect of the embodiments, the angle α is about0° and the angle β is an acute angle.

According to the first aspect of the embodiments, the angle α is anacute angle and the angle β is an acute angle.

According to a second aspect of the embodiments, an audio-videodistribution system is provided, comprising: an audio-video encoderadapted to receive at least one high definition multimedia interface(HDMI) encoded audio-video (AV) signal via an HDMI cable, encode thesame as an AV-over-internet protocol (AV-over-IP) signal, transmit theAV-over-IP signal to an AV receiver/splitter, wherein the AVreceiver/splitter is adapted to receive the AV-over-IP signal, split theaudio portion from the video portion of the AV-over-IP signal, convertthe video portion back to an HDMI encoded video signal, re-transmit theHDMI encoded video signal to a display that is adapted to display anHDMI encoded video signal, and re-transmit the audio portion to one ormore loudspeakers, and wherein the audio-video encodercomprises—electronic heat generating circuitry; a printed circuit boardupon which the electronic heat generating circuitry is located on afirst side; a substantially adiabatic enclosure adapted to house theelectronic heat generating circuitry, printed circuit board and othercomponents of the dual mode cooling system; a finned heat sink adaptedto be in thermal contact with the electronic heat generating circuitry,the finned heat sink comprising a plurality of heat radiating fins; afaceplate adapted to enclose the substantially adiabatic enclosure andseal the substantially adiabatic enclosure against an interior wall, andwherein the faceplate comprises—a cool air intake port adapted toreceive cool air from an area external to the substantially adiabaticenclosure and provide the cool air to an interior portion of thesubstantially adiabatic enclosure, and a heated air exhaust port adaptedto exhaust heated air out of the enclosure into an area external to theenclosure; and a fan adapted to receive cool air from the cool airintake port and blow the cool air through the plurality of heatradiating fins of the finned heat sink to remove substantially all ofthe heat generated by the electronic heat generating circuitry viaconvection and generate heated air, and wherein the heated air isexhausted through the heated air exhaust port by the fan, and wherein anactive cooling path comprises a path of air as it is received from thecool air intake, passes through the fan, over the heated surface, andthen is exhausted from the heated air exhaust port, and wherein theheated air exhaust port is separated with respect to the cool air intakeport.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects and features of the embodiments will becomeapparent and more readily appreciated from the following description ofthe embodiments with reference to the following figures. Differentaspects of the embodiments are illustrated in reference figures of thedrawings. It is intended that the embodiments and figures disclosedherein are to be considered to be illustrative rather than limiting. Thecomponents in the drawings are not necessarily drawn to scale, emphasisinstead being placed upon clearly illustrating the principles of theaspects of the embodiments. In the drawings, like reference numeralsdesignate corresponding parts throughout the several views.

FIG. 1 illustrates a conventional audio video installation in a bedroomthat includes audio-video circuitry housing within a gang box installedon an interior wall.

FIG. 2 illustrates a cut-away side view of the audio-video circuitryhousing within a gang box installed in the interior wall as shown inFIG. 1 .

FIG. 3 illustrates a front view of a faceplate for use with a gang boxthat houses a dual mode cooling system for electronics that can behoused within audio video circuitry housing and used in a gang boxaccording to aspects of the embodiments

FIG. 4 illustrates a partial top view of the faceplate shown in FIG. 3according to aspects of the embodiments.

FIG. 5 illustrates a top view of the audio video circuitry housing ofFIGS. 2 and 3 with the dual mode cooling system according to aspects ofthe embodiments.

FIG. 6 illustrates a detailed top view of a portion of the view shown inFIG. 5 according to aspects of the embodiments.

FIG. 7 illustrates a sectional view along line A-A of FIG. 5 accordingto aspects of the embodiments.

FIG. 8 illustrates a rear view of the dual mode cooling system shown inFIG. 5 according to aspects of the embodiments.

FIG. 9 illustrates a top view of the audio video circuitry housing ofFIGS. 2 and 3 with a second dual mode cooling system according tofurther aspects of the embodiments, substantially similar to the view ofFIG. 5 .

FIG. 10 illustrates a detailed top view of a portion of the view shownin FIG. 9 according to aspects of the embodiments.

FIGS. 11 and 12 illustrate isometric views of a third dual mode coolingsystem according to aspects of the embodiments.

FIGS. 13-15 illustrate isometric views of a fourth dual mode coolingsystem according to aspects of the embodiments.

FIG. 16 illustrates an isometric view of a fifth dual mode coolingsystem according to aspects of the embodiments.

DETAILED DESCRIPTION

The embodiments are described more fully hereinafter with reference tothe accompanying drawings, in which embodiments of the inventive conceptare shown. In the drawings, the size and relative sizes of layers andregions may be exaggerated for clarity. Like numbers refer to likeelements throughout. The embodiments may, however, be embodied in manydifferent forms and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the scope of the inventive concept to those skilled in the art.The scope of the embodiments is therefore defined by the appendedclaims. The detailed description that follows is written from the pointof view of a control systems company, so it is to be understood thatgenerally the concepts discussed herein are applicable to varioussubsystems and not limited to only a particular controlled device orclass of devices, such as the cooling of electronic circuitry such as AVelectronic circuitry that can be housed in within AVCH 206 that islocated within gang box 104 in internal wall 116.

Reference throughout the specification to “one embodiment” or “anembodiment” means that a particular feature, structure, orcharacteristic described in connection with an embodiment is included inat least one embodiment of the embodiments. Thus, the appearance of thephrases “in one embodiment” or “in an embodiment” in various placesthroughout the specification is not necessarily referring to the sameembodiment. Further, the particular feature, structures, orcharacteristics may be combined in any suitable manner in one or moreembodiments.

List of Reference Numbers for the Elements in the Drawings in NumericalOrder

The following is a list of the major elements in the drawings innumerical order.

-   -   100 Audio System Installation Location (Room)    -   102 Faceplate    -   104 Standard Gang Box (Gang Box)    -   106 Internal Audio Video (AV) Cable (Coax, Digital (HDMI))    -   108 External AV Cable (Coax, Digital (HDMI))    -   110 AV Receiver/Modem (AV Device)    -   112 AV Display    -   114 Bureau/Desk    -   116 Internal Wall    -   118 AV Circuitry    -   120 External AV Connector    -   122 Interior Area    -   202 Exterior Wall    -   204 Wall Cavity    -   206 Audio Video (AV) Circuitry Housing    -   302 Cool Air Intake Ports    -   304 Heated Air Exhaust Ports    -   402 Cool Air    -   404 Heated Air (Heat transferred by Convection)    -   406 First Imaginary Line    -   408 Second Imaginary Line    -   500 Dual Mode Cooling Assembly    -   502 Heat Conducting Metal Block (HCMB)    -   504 Heat Pipe (HP)    -   506 Integrated Circuit (IC)    -   508 Finned Heat Sink (FHS)    -   510 Baffle    -   512 Centrifugal Fan (CF)    -   514 Printed Circuit Board (PCB)    -   516 Cool Air Baffle Zone    -   518 Heated Air Baffle Zone    -   520 Gap Pad    -   522 Cool Air Holes    -   524 Heated Air Holes    -   526 First Active Cooling Path    -   602 Through Hole Thermal Via    -   604 Conducted Heat (Heat transferred by Conduction)    -   606 First Passive Cooling Path    -   608 Second Passive Cooling Path    -   610 Third Passive Cooling Path    -   900 Second Dual Mode Cooling System    -   902 Fourth Passive Cooling Path    -   904 Fifth Passive Cooling Path    -   1100 Third Dual Mode Cooling System    -   1300 Fourth Dual Mode Cooling System    -   1600 Fifth Dual Mode Cooling System

List of Acronyms Used in the Specification in Alphabetical Order

The following is a list of the acronyms used in the specification inalphabetical order.

-   -   ASIC Application Specific Integrated Circuit    -   AV Audio Video    -   AVCH AV Circuitry Housing    -   CF Centrifugal Fan    -   CPU Central Processing Unit    -   DRAM Dynamic Random Access Memory    -   FHS Finned Heat Sink    -   FPGA Field Programmable Gate Array    -   HCMB Heat Conducting Metal Block    -   HDMI High Definition Multimedia Interface    -   HP Heat Pipe    -   IC Integrated Circuit    -   PCB Printed Circuit Board    -   SoC System on a Chip

The different aspects of the embodiments described herein pertain to thecontext of a systems, methods, and modes for a dual mode cooling systemfor electronics with limited access to cooling surfaces or ducts, but isnot limited thereto, except as may be set forth expressly in theappended claims.

Crestron Electronics Inc. is one of the world's leading manufacturer ofcontrol and automation systems, innovating technology to simplify andenhance modern lifestyles and businesses. Crestron designs,manufactures, and offers for sale integrated solutions to control audio,video, computer, and environmental systems. In addition, the devices andsystems offered by Crestron streamlines technology, improving thequality of life in commercial buildings, universities, hotels,hospitals, and homes, among other locations. Accordingly, the systems,methods, and modes of the aspects of the embodiments described herein,as embodied as dual mode cooling assembly 500 can be manufactured byCrestron Electronics Inc., located in Rockleigh, NJ, and used in adevice marketed and sold as and NVX wall encoder, part numberDM-NVX-E20-2G, and used with DM-NVX®.

The DM-NVX-E20-2G encoder can accept (receive) high definitionmultimedia interface (HDMI) video and encode it into an AV-over-IPstream. In the simplest case, the video and audio is received through anHDMI connector/cable by the DM-NVX-E20-2G encoder, then transmitted overa network as AV-over-IP to a decoder that then converts it back to HDMI.The video and audio is then rendered on a display or television. Inaddition, the audio can be “stripped” and transmitted to separateloudspeakers. An AV switcher matrix can be implemented by havingdecoders subscribe to the multicast IP stream of the encoder they wantto display. Accordingly, the DM-NVX-E20-2G encoder can be located withininterior walls in a standard gang-box enclosure yet operate safely bydispersing heat using the systems and methods described herein aspectsof the embodiments.

In view of the problems discussed above in regard to current uses of AVand other circuitry in small gang box 104 installations, a compactactive cooling solution is needed that can fit in these enclosures andonly use the front surface of faceplate 102 to exchange the air with theroom is desired.

According to further aspects of the embodiments, dual mode coolingassembly 500 (as well as the others described herein) can work with manydifferent types of faceplates, including by not limited to a standardDecora faceplate as faceplate 102, and should not protrude from internalwall 116 to assist heat transfer. Any required fans, heat sinks, andother heat dissipating devices must be contained within AVCH 206 locatedwithin gang box 104 located inside wall cavity 204. Wall cavity 204 caninclude insulation, for example, on exterior walls.

In addition to the active cooling required to remove the run-time heat,it is desirable to also have a passive cooling solution that can allowshutting off fans when the unit is in a low power state. For example, itis desirable that a wall plate video receiver located behind atelevision in a bedroom be substantially silent when the television isoff, and the occupants are sleeping. Such low power state can include astate in which all or substantially all of the circuitry is in aninactive state. An inactive state can include a condition of electroniccircuitry not actively processing AV signals or other signals that cangenerate heat.

According to aspects of the embodiments, an active cooling path includesthe use of a fan or some other electromechanical device to moverelatively cooler air across one or more heated surfaces to remove heatvia convection. The heated surfaces can be the heat generating devicesthemselves, or can be other devices that have received heat viaconduction from other devices and/or the heat generating device.According to aspects of the embodiments, a passive cooling path does notinclude moving air, and instead comprises one or more heat conductingand/or radiating devices that accept and move heat via conduction to oneor more external surfaces wherein heat is expelled via convection andradiation to an ambient environment.

FIG. 3 illustrates a front view of faceplate 102 for use with gang box104 that houses dual mode cooling system 500 for electronics that can behoused within AVCH 206 and used in gang box 104 according to aspects ofthe embodiments, and FIG. 4 illustrates a partial top view of faceplate102 shown in FIG. 3 according to aspects of the embodiments.

Faceplate 102 used in dual mode cooling assembly 500 can be of astandard size, though that need not necessarily be the case. Faceplate102 as shown on in FIGS. 3 and 4 comprises external AV video connector120, cool air intake ports 302, and heated air exhaust ports 304according to aspects of the embodiments. As those of skill in the artcan appreciate, the terms “cool,” “hot,” “heated,” and “cooled,” are allterms of degree—that is, air is “cool” in regard to other air that ishotter, or has been heated. In terms of the aspects of the embodiments,cool air 402 is ambient air that could be “cooled” by air conditioning,or non-air conditioned air. Heated air 404 is cool air 402 that has beenheated by heat transferred by convection processes, well known to thoseof skill in the art. First imaginary lines 406 a,b are orthogonal toouter surface of faceplate 102, and second imaginary lines 408 a,bextend the intake and exhaust port directions, respectively, withrespect to faceplate 102. First and second imaginary lines 406, 408 areincluded to facilitate the discussion regarding the relative angularplacement of cool air intake ports 302 and heated air exhaust ports 304,in regard to each other and faceplate 102.

According to an aspect of the embodiments, cool air intake ports 302 andheated air exhaust ports 304 respectively can be angled away from eachother, so that there is a reduced chance of heated air 404 that isexhausted from heated air exhaust ports 304 from being pulled into coolair intake port 302 (substantially only cool air 402 enters through coolair intake ports 302) according to aspects of the embodiments. That is,cool air intake port 302 can be formed at first angle α, wherein firstangle α is the angle between first imaginary line 406 a (a line that isorthogonal or perpendicular to an outer surface of faceplate 102) andsecond imaginary line 408 a (wherein second imaginary line 408 a extendsthe intake port direction with respect to faceplate 102).

Similarly, heated air exhaust port 304 can be formed at second angle β,wherein second angle β is the angle between first imaginary line 406 b(a line that is orthogonal or perpendicular to an outer surface offaceplate 102) and second imaginary line 408 b (wherein second imaginaryline 408 b extends the exhaust port direction with respect to faceplate102).

Thus, according to aspects of the embodiments, first and second anglesα, β can be acute but oppositely directed with respect to a normal ofthe surface of faceplate 102. According to further aspects of theembodiments, cool air intake ports 302 can be cater-cornered withrespect to heated air exhaust ports 304. According to further aspects ofthe embodiments, first and second angles α, β can be the same, ordifferent angular values. Furthermore, there can be different numbers ofcool air intake ports 302 versus heated air exhaust ports 304, or thenumber of intake ports 302 can be the same as the number of heated airexhaust ports 304 (as the non-limiting example of FIG. 4 illustrates).According to further aspects of the embodiments, cool air intake port302 and heated air exhaust port 304 are not necessarily cater-corneredwith respect to each other, but need only be separated a certain minimumdistance from each other. Note that in FIG. 4 , external AV connector120 has been omitted in fulfillment of the dual purposes of clarity andbrevity. According to aspects of the embodiments, first and secondangles α, β can both be 0° (i.e., first and second imaginary lines 406a,b being substantially perpendicular to the surface of faceplate 102);first and second angles α, β can both be about 90° (as those of skill inthe art can appreciate, if either or both of first and second angles α,β were 90°, then respective cool air intake port 302 and/or heated airexhaust port 304 would not pass through faceplate 102; therefore anangle of 90° for either or both of first and second angles α, β is notpossible, and in practicality each of first and second angles α, β islimited to about 85°); and first and second angles α, β can both bedifferent from each other (including practically any acute angle).According to further aspects of the embodiments, first and second anglesα, β are optimally about 45°, and can range from about 40° to about 50°.

Shown in FIG. 5 are cool air holes 522 and heated air holes 524 inprinted circuit board (PCB) 514. Cool air 402 flows through one or morecool air holes 522 that can be located in PCB 514 in cool air bafflezone 516 according to aspects of the embodiments. The placement of coolair holes 522 in FIG. 5 is but by way of non-limiting example only; theactual placement will be dictated by the placement of circuit componentsand available space on PCB 514, and the same applies to heated air holes524 according to aspects of the embodiments. Cool air holes 522 allowcool air 402 to flow more easily into the area of AVCH 206 wherecentrifugal fan (CF) 512 is located. According to aspects of theembodiment, CF 512 can also be an axial fan. Similarly, heated air holes524 allow heated air 404 to flow more easily from heated air baffle zone518 within the area of AVCH 206 that is further away from heated airexhaust ports 304 to the area that is closer to heated air exhaust ports304 according to aspects of the embodiments.

FIG. 5 illustrates a top view of AVCH 206 of FIGS. 2 and 3 with dualmode cooling system 500 according to aspects of the embodiments, andFIG. 6 illustrates a detailed top view of a portion of the view shown inFIG. 5 according to aspects of the embodiments. Dual mode coolingassembly 500 comprises faceplate 102 with cool air intake ports 302 andheated air exhaust ports 304, heat conducting metal block (HCMB) 502,gap pad 520, heat pipe 504, finned heat sink (FHS) 508, CF 512, throughhole thermal via (thermal via) 602 (shown in FIG. 6 ), and baffles 510a,b according to aspects of the embodiments. Shown also in FIG. 5 is asingle IC 506, although it typically would be the case that there wouldbe numerous and different ICs 506 n-m; however, for the purposes of thisdiscussion, and to simply the drawings figures to the extent possible toappreciate the different aspects of the embodiments, it will be presumedthat the majority of the heat is generated by the one IC 506, and dualmode cooling assembly 500 has been implemented in the manner shown toexpel the heat generated by IC 506 as quickly and quietly as possibleaccording to aspects of the embodiments.

As discussed above, AVCH 206 and gang box 104 are both substantiallysealed devices, with very little if any additional ports for heated air404 to be expelled other than through the mechanisms of the aspects ofthe embodiments. Particularly, dual mode cooling assembly 500 has beendesigned and implemented to disperse heat generated by all of AVcircuitry 118 or any heat generating circuitry and in particular IC 506through only heated air exhaust ports 304 (via convection) and throughfaceplate 102 (mainly through via conduction and convection, and someradiation) according to aspects of the embodiments.

Thus, for purposes of this discussion, in fulfillment of the dualpurposes of clarity and brevity, it shall be presumed that the majorityof heat to be dispersed from the interior of AVCH 206 (and thus gang box104) is generated by IC 506. As those of skill in the art canappreciate, there are three main ways heat can be transferred:conduction (through one solid material to another); convection (heattransferred through liquids or gases); or radiation (as electromagneticradiation). Most of the heat in dual mode cooling assembly 500 istransferred via conduction and convection while in an active coolingmode, and while in the passive cooling mode, all three modes of heattransfer will be active.

As shown in FIG. 5 , cool air 402 enters AVCH 206 via cool air intakeports 302, and enters cool air baffle zone 516. Cool air baffle zone 516is formed by baffles 510 a,b, which essentially divides the interiorvolume of AVCH 206 into two separate volumes, the second being heatedair baffle zone 518. Baffle zones 516, 518 are appropriately sized tomaximize the intake of enough cool air 402 to remove as much heat aspossible, and further maximize the exhaust of heated air 404 to theexterior of AVCH 206 through heated air exhaust ports 304.

Cool air 402 is drawn into AVCH 206 through cool air intake ports 302 byCF 512. Cool air 402 is then directed through the fins of FHS 508, whereheat that has been transferred via conduction is convected away by aconvection flow of cool air 402. The fins of FHS 508 can be regarded ashigh density, meaning the fins are appropriately spaced closely togetherto achieve a maximum amount of surface area from which heat can betransferred from the fins of FHS 508 to cool air 402 that is forced pastthe fins via CF 512 according to aspects of the embodiments.

Also shown in FIG. 5 is HCMB 502 that is mounted on top of IC 506, andconducts heat from IC 506 through gap pad 520 to faceplate 102 viaconduction according to aspects of the embodiments. Gap pad 520 isgenerally made of a flexible material that is compressible such thatHCMB 502 is thermally connected to faceplate 102 and provides a suitablemechanical fit. According to further aspects of the embodiments, heatpipe 504 conducts heat from IC 506 and HCMB 502 to FHS 508. The numberand placement of the heat conducting elements shown in FIGS. 5-8 is notmeant to be taking in a limiting manner, but is only an example of howsuch elements can be arranged, and/or how many of such elements can beused in dual mode cooling assembly 500 according to aspects of theembodiments.

Referring now to FIG. 6 , which illustrates a detailed top view of aportion of the view shown in FIG. 5 , certain portions of the heat flowwithin dual mode cooling assembly 500 are shown in detail. IC 506generates heat, and some of that heat flows via heat pipe 504 asconducted heat 604, into FHS 508. Conducted heat 604 also flows from IC506 into HCMB 502 then through gap pad 520 to faceplate 102 and out offaceplate 102 as heated air 404. According to aspects of theembodiments, heat transferred through the thermally interconnectedobjects such as IC 506, HCMB 502, gap pad 520, and faceplate 102 can bereferred to as a passive cooling path. Thus, faceplate 102, in concertwith HCMB 502, acts as a large heat sink to the heat generated by IC 506according to aspects of the embodiments.

Heated air 404 (heat transferred by convection) also flows from IC 506into the interior space of AVCH 206, which is heated air baffle zone518. Some of the heat in heated air 404 travels through faceplate 102 tothe exterior of AVCH 206 and gang box 104 (e.g., interior area.

Heat that is generated by IC 506 flows from IC 506 through thermal vias602 a-d as conducted heat 604, wherein each thermal via 602 is builtinto PCB 514 according to aspects of the embodiment. As those of skillin the art can appreciate, vias can be used in PCBs to provide a ground,power, or signal path between different planes of a PCB. Vias areespecially useful when additional current flow is needed between powerplanes or ground planes of a PCB. Such vias are typically hollow,cylindrically shaped filled with solder during the soldering process(though of course the vias need not necessarily be cylindrical inshape). Conducted heat 604 flowing through thermal via 602 into FHS 508can also be referred to as a passive cooling path, according to aspectsof the embodiments.

As shown in FIGS. 5-8 , CF 512 forces cool air 402 about the fins of FHS508, extracting heat from the fins via convection, and this transfer ofheat can be referred to as an active cooling path, according to furtheraspects of the embodiments. As cool air 402 passes through the fins ofFHS 508, heat is transferred to the air to form heated air 404 that isexhausted out of heated air exhaust air ports 304 according to aspectsof the embodiments. Thus, dual mode cooling assembly 500 comprises bothactive and passive cooling paths. As shown in FIGS. 5 and 6 ,respectively, first active cooling path 526 comprises the convectivetransfer of heat from FHS 508 to the interior of AVCH 206, in heated airbaffle zone 518 according to aspects of the embodiments. Heated airbaffle zone 518 also receives heat from IC 506 via second and thirdpassive cooling paths 608, 610, which transfers the heat via conductionto the fins of FHS 508. The heat that has then been transferred to thefins of FHS 508 is then transferred to heated air baffle zone via firstactive cooling path 526—cool air 402 moving over the fins of FHS 508 andremoving the heat via convection. First passive cooling path 606transfers heat via conduction from IC 506 to faceplate 102 (in themanner described above) through HCMB 502 and gap pad 520; heat is thendissipated convectively from faceplate 102 into interior area 122.Second passive cooling path 608 comprises the flow or transfer of heatfrom IC 506 through thermal vias 602 into FHS 508 according to aspectsof the embodiments. Third passive cooling path 610 comprises the flow ortransfer of heat from IC 506 through heat pipe 504 into FHS 508according to aspects of the embodiments.

FIG. 7 illustrates a sectional view along line A-A of FIG. 5 accordingto aspects of the embodiments, and FIG. 8 illustrates a rear view ofdual mode cooling system 500 according to aspects of the embodiments.

According to aspects of the embodiments, the amount of heat transferbetween IC 506 and faceplate 102 can be tuned so that the touchablesurfaces do not become too hot by adjusting the size/surface area ofHCMB 502 and the thermal impedance of gap pad 520 used to transfer heatfrom HCMB 502 to faceplate 102. The thermal impedance of gap pad 520 canbe determined by the material used, the contact surface area and thethickness of gap pad 520.

The thermal impedance from IC 506 to FHS 508 can also be tuned bychanging the material used (copper, aluminum alloy, among other metalsand/or materials (such as carbon composite materials)) in FHS 508,changing its cross sectional area or by incorporating one or morethermal vias 602 (as shown in FIG. 6 ).

Gang boxes 104 and AVCH 206 are relatively shallow, and thus positioningof CF 512 in line with FHS 508 may not be possible. In this case, CF 512can be rotated about with respect to FHS 508 and use features of theenclosure (interior of AVCH 206) to provide a curved transition as theair makes a turn to reduce the air flow resistance.

In addition to the active cooling required to remove the run-time heat(i.e., the heat generated while AV circuitry 118 is operating (i.e.,active cooling path)), it is desirable to also have a passive coolingsolution (i.e., passive cooling path), as described above, that canallow shutting off CF 512 when AV circuitry 118 is in a low power state.Such low power state can include a state in which all or substantiallyall of the circuitry is in an inactive state. An inactive state caninclude a condition of electronic circuitry not actively processing AVsignals. Even in an inactive state (no AV signals being processed), thecircuitry will still continue to generate some heat because power isapplied to all or some of the circuitry and will therefore generate someheat.

In addition, it is desirable that a wall plate video receiver locatedbehind a television in a bedroom be as silent as possible when thetelevision is turned off, and the occupants are sleeping (because thefans have been shut off). For a period of time following shut down ofactive AV signal processing, the circuitry inside the wall plate videoreceiver will still emit significant amounts of heat for a period oftime following shut off. Aspects of the embodiments provide for anefficient manner of cooling even after shutdown of heat generating ICs506 and therefore CF 512, such that temperatures on faceplate 102following shut down remain at or below a safe temperature. Such atemperature can be about 70° C., according to the Underwriter'sLaboratories/International Electrotechnical Commission UL/IEC 62368standard. Aspects of the embodiments described herein provide for suchcooling by conducting the heat to a first predetermined area of thefaceplate of sufficient size such that any heat present just followingshutdown is spread to a large enough area to affect such safe transferof heat.

FIG. 9 illustrates a top view of the gang box of FIGS. 2 and 3 with adual mode cooling system according to further aspects of theembodiments, substantially similar to the view of FIG. 5 . and FIG. 10illustrates a detailed top view of a portion of the view shown in FIG. 9according to aspects of the embodiments.

The aspects of the embodiments shown in FIGS. 9 and 10 are substantiallysimilar to the aspects of the embodiments shown in FIGS. 2-8 ;therefore, in fulfillment of the dual purposes of brevity and clarity, adetailed discussion of the substantially similar portions has beenomitted from herein. FIG. 9 illustrates a top view of AVCH 206 of FIGS.2 and 3 with second dual mode cooling system 900 according to aspects ofthe embodiments, and FIG. 10 illustrates a detailed top view of aportion of the view shown in FIG. 9 according to aspects of theembodiments. Second dual mode cooling assembly 900 comprises faceplate102 with cool air intake ports 302 and heated air exhaust ports 304,HCMB 502, gap pad 520, heat pipe 504, finned heat sink (FHS) 508, CF512, thermal via 602 (shown in FIG. 10 ), and baffles 510 a,b accordingto aspects of the embodiments. Shown also in FIG. 9 is a single IC 506,although it typically would be the case that there would be numerous anddifferent ICs 506 n-m; however, for the purposes of this discussion, andto simply the drawings figures to the extent possible to appreciate thedifferent aspects of the embodiments, it will be presumed that themajority of the heat is generated by the one IC 506, and second dualmode cooling assembly 900 has been implemented in the manner shown todissipate the heat generated by IC 506 as quickly and quietly aspossible according to aspects of the embodiments. The aspects of theembodiments of second dual mode cooling system 900 differs from that ofFIG. 5 and dual mode cooling system 500 in that IC 506 is now on anopposite side of PCB 514, and heat pipe 504 is omitted.

As with dual mode cooling system 500, the majority of the heat in seconddual mode cooling assembly 900 is transferred via conduction andconvection.

As shown in FIG. 9 , cool air 402 enters AVCH 206 via cool air intakeports 302, and enters cool air baffle zone 516. Cool air baffle zone 516is formed by baffles 510 a,b, which essentially divides the interiorvolume of AVCH 206 into two separate volumes, the second being heatedair baffle zone 518. Baffle zones 516, 518 are appropriately sized tomaximize the intake of enough cool air 402 to remove as much heat aspossible, and further maximize the exhaust of heated air 404 to theexterior of AVCH 206 through heated air exhaust ports 304.

Cool air 402 is drawn into AVCH 206 through cool air intake ports 302 byCF 512. Cool air 402 is then directed through the fins of FHS 508, whereheat that has been transferred via conduction is convected away by aconvection flow of cool air 402. In second dual mode cooling system 900,FHS 508 is mounted directly on top of IC 506 according to aspects of theembodiments. The fins of FHS 508 can be regarded as high density,meaning the fins are appropriately spaced closely together to achieve amaximum amount of surface area from which heat can be transferred fromthe fins of FHS 508 to cool air 402 that is forced past the fins via CF512 according to aspects of the embodiments.

Also shown in FIG. 9 are cool air holes 522 in PCB 514 and heated airholes 524 in PCB 514. Cool air 402 flows through one or more cool airholes 522 that can be located in PCB 514 in cool air baffle zone 516according to aspects of the embodiments. The placement of cool air holes522 in FIG. 9 is but by way of non-limiting example only; the actualplacement will be dictated by the placement of circuit components andavailable space on PCB 514, and the same applies to heated air holes 524according to aspects of the embodiments. Cool air holes 522 allow coolair 402 to flow into the area of AVCH 206 where CF 512 is located moreeasily. Similarly, heated air holes 524 allow heated air 404 to flowmore easily from the area of AVCH 206 in heated air baffle zone 518 thatis further away from heated air exhaust ports 314 to the area that iscloser to heated air exhaust ports 314 according to aspects of theembodiments.

Also shown in FIG. 9 is heat conducting metal block (HCMB) 502 thatmounts on top of gap pad 520 a that mounts onto PCB 514. Heat from IC506 is transferred through PCB 514, but more efficiently through thermalvias 602 (shown in FIG. 10 ) to gap pad 520 a. The heat from IC 506 thentravels through gap pad 520 a to HCMB 502, which then conducts the heatfrom IC 506 through second gap pad 520 b to faceplate 102 according toaspects of the embodiments. Most of the heat in the area of gap pad 520a from IC 506 is transferred to faceplate 102 is via conduction, and theheat that is transferred to faceplate 102 is then transferred viaconvention to interior area 122 of room 100.

Gap pad 520 is generally made of a flexible material that iscompressible such that HCMB 502 is thermally connected to faceplate 102and provides a suitable mechanical fit. According to further aspects ofthe embodiments, heat pipe 504 could be included to conduct heat from IC506 to HCMB 502 to faceplate 102. The number and placement of the heatconducting elements shown in FIGS. 9 and 10 is not meant to be taking ina limiting manner, but is only an example of how such elements can bearranged, and/or how many of such elements can be used in second dualmode cooling assembly 900 according to aspects of the embodiments.

Referring now to FIG. 10 , which is a partial view of FIG. 9 , certainportions of the heat flow are shown in detail. IC 506 generates heatthat is then transferred to FHS 508. Heat generated by IC 506 also istransferred to HCMB 502 through thermal vias 602 in PCB 514, through gappad 520 a, then into HCMB 502, then through gap pad 520 b to faceplate102 and out of faceplate 102 as heated air 404. According to aspects ofthe embodiments, heat transferred through the thermally interconnectedobjects such as IC 506, HCMB 502, gap pad 520, and faceplate 102 can bereferred to as a passive heat path. Thus, faceplate 102, in concert withHCMB 502 acts as a large heat sink to the heat generated by IC 506according to aspects of the embodiments.

Heated air 404 (heat transferred by convection) also flows from IC 506into the interior space of AVCH 206, which is heated air baffle zone518. Some of the heat in heated air 404 travels through faceplate 102 tothe exterior of AVCH 206 (e.g., interior area 122 of room 100).

Heat that is generated by IC 506 flows from IC 506 through thermal vias602 a-d as conducted heat 604, wherein each thermal via 602 is builtinto PCB 514 according to aspects of the embodiment. As those of skillin the art can appreciate, vias can be used in PCBs to provide a ground,power, or signal path between different planes of a PCB. Vias areespecially useful when additional current flow is needed between powerplanes or ground planes of a PCB. Such vias are typically hollow andcylindrically shaped, and are filled with solder during the solderingprocess (though of course the vias need not necessarily be cylindricalin shape). According to aspects of the embodiments, thermal vias 602 canbe filled with solder during the solder process to increase heat flowfrom one area to another. Conducted heat 604 flowing through thermal via602 into FHS 508 can also be referred to as a passive cooling path,according to aspects of the embodiments.

As shown in FIGS. 9 and 10 , CF 512 forces cool air 402 between the finsof FHS 508, extracting heat from the fins via convection, and thistransfer of heat can be referred to as an active cooling path, accordingto further aspects of the embodiments. As cool air 402 passes about thefins of FHS 508, heat is transferred to the air to form heated air 404that is exhausted out through heated air exhaust ports 304 according toaspects of the embodiments. Thus, second dual mode cooling assembly 900comprises both active and passive cooling paths.

As shown in FIGS. 9-10 , CF 512 forces cool air 402 between the fins ofFHS 508, extracting heat from the fins via convection, and this transferof heat can be referred to as an active cooling path, according tofurther aspects of the embodiments. As cool air 402 passes between thefins of FHS 508, heat is transferred to the air to form heated air 404that is exhausted out of heated air exhaust ports 304 according toaspects of the embodiments. Thus, dual mode cooling assemblies 500 and900 comprises both active and passive cooling paths. According tofurther aspects of the embodiments, dual mode cooling assemblies 500 and900, as well as 1100, 1300, and 1600 as described in further detailbelow, can include any combination of passive and active cooling paths,including any one alone or any combination of active and passive coolingpaths.

As shown in 9 and 10, respectively, first active cooling path 526comprises the convective transfer of heat from FHS 508 to the interiorof AVCH 206, in heated air baffle zone 518 according to aspects of theembodiments. Heated air baffle zone 518 also receives heat from IC 506via fourth passive cooling path 902, the transferred heat of which isdissipated into heated air baffle zone 518 via first active cooling path526. Fourth passive cooling path 902 comprises the flow or transfer ofheat from IC 506 into FHS 508 according to aspects of the embodiments.Fifth passive cooling path 904 transfers heat via conduction from IC 506to faceplate 102 (in the manner described above) through thermal vias602, gap pad 520 a, HCMB 502, and gap pad 520 b; heat is then dissipatedconvectively from faceplate 102 into interior area 122 of room 100.

FIGS. 11 and 12 illustrate isometric views of third dual mode coolingsystem 1100 according to aspects of the embodiments.

According to aspects of the embodiments, third dual mode cooling system1100 comprises CF 512 (blower) that pulls air into the unit, across FHS508 and other components, and exhausts the air to interior area 122 ofroom 100. There are also gap pads 520 that thermally connect IC 506 tofaceplate 102, which has exterior fins (FHS 508) to transfer the heat tointerior area 122 of room 100 when the fan speed of CF 512 is low orturned off.

FIGS. 13-15 illustrate isometric views of fourth dual mode cooling 1300system according to aspects of the embodiments.

According to aspects of the embodiments, fourth dual mode cooling system1300 comprises CF 512 that pulls cool air 402 into the unit through coolair intake ports 302. Cool air 402 gains heat via heat generatingdevices (i.e., AV circuitry 118), becoming heated air 404, beforeentering CF 512. CF 512 then exhausts heated air 404 through the fins ofFHS 508 and then out of AVCH 206 via heated air exhaust ports 304. Thephysical separation between cool air intake ports 302 and heated airexhaust ports 304 provides for the separation of cool air 402 and heatedair 404, which optimizes performance of CF 512. There are also gap pads520 that link the heat-generating electronic devices (e.g., IC 506) tothe front faceplate 102, which contains FHS 508, to transfer the heat tothe ambient when the fan speed of CF 512 is low or off.

FIG. 16 illustrates an isometric view of fifth dual mode cooling system1600 according to aspects of the embodiments.

According to aspects of the embodiments, fifth dual mode cooling system1600 comprises CF 512 that pulls cool air 402 into AVCH 206, circulatescool air 402 about electronic components (IC 506) such that cool air 402becomes heated air 404, and then exhausts heated air 404 through FHS508. FHS 508 (not shown), is mounted in such manner that it creates aduct for heated air 404 to exhaust into interior area 122 of room 100.FHS 508 allows for remote cooling as it can utilize HCMB and heat-pipes502, 504, to attach to heat-generating electronic devices (IC 506)throughout the unit. There are also gap pads 520 that connect theheat-generating electronic devices (IC 506) or FHS 508 to the frontfaceplate 102, which dissipates the heat to interior area 122 of room100 when the fan speed of CF 512 is low or turned off.

According to further aspects of the embodiments, dual mode coolingassemblies 500 and 900, as well as 1100, 1300, and 1600 as described indetail above, can include any combination of passive and active coolingpaths, including any one alone or any combination of active and passivecooling paths.

As discussed in regard to one or more of the Figures described herein,reference is made to several dimensions (which may include, but is notlimited to radii, angles, height, size, volume, among dimensionaldescriptors), as well as relative positions and/or locations. Those ofskill in the art can appreciate that although examples and/ordiscussions of dimensions/positions/locations are provided, these shouldnot be taken in a limiting manner except as otherwise noted. That is,the aspects of the embodiments are not to be construed as defined orlimited by the specific example of the dimensions/positions/locationsshown and discussed, but instead are provided merely for illustrating anexample of what a device that incorporates the aspects of theembodiments could, in a non-limiting manner, looks like and/or isarranged. Furthermore, as those of skill in the art can appreciate,since the aspects of the embodiments are directed towards a physicalobject, with dimensions/positions/locations characteristics, all of theparts will have various dimensions/positions/locations, some of whichare not shown in fulfillment of the dual purposes of clarity andbrevity. According to still further aspects of the embodiments, some ofthese objects will have dimensions/positions/locations characteristicsthat lend themselves to aesthetic aspects; in fulfillment of the dualpurposes of clarity and brevity, dimensions/positions/locations in thisregard may have been omitted. Therefore, as the aspects of theembodiments are directed towards systems, methods, and modes for a dualmode cooling system for electronics with limited access to coolingsurfaces or ducts, it is to be understood that some of thedimensions/positions/locations of the different objects have been shownand some dimensions/positions/locations have not been shown, and theinclusion and/or exclusion should be understood by those of skill in theart especially in view of the discussion herein. Attention is nowdirected towards FIG. 4 ,

The disclosed embodiments provide systems, methods, and modes for a dualmode cooling system for electronics with limited access to coolingsurfaces or ducts. It should be understood that this description is notintended to limit the embodiments. On the contrary, the embodiments areintended to cover alternatives, modifications, and equivalents, whichare included in the spirit and scope of the embodiments as defined bythe appended claims. Further, in the detailed description of theembodiments, numerous specific details are set forth to provide acomprehensive understanding of the claimed embodiments. However, oneskilled in the art would understand that various embodiments may bepracticed without such specific details.

Although the features and elements of aspects of the embodiments aredescribed being in particular combinations, each feature or element canbe used alone, without the other features and elements of theembodiments, or in various combinations with or without other featuresand elements disclosed herein.

This written description uses examples of the subject matter disclosedto enable any person skilled in the art to practice the same, includingmaking and using any devices or systems and performing any incorporatedmethods. The patentable scope of the subject matter is defined by theclaims, and may include other examples that occur to those skilled inthe art. Such other examples are intended to be within the scope of theclaims.

The above-described embodiments are intended to be illustrative in allrespects, rather than restrictive, of the embodiments. Thus, theembodiments are capable of many variations in detailed implementationthat can be derived from the description contained herein by a personskilled in the art. No element, act, or instruction used in thedescription of the present application should be construed as criticalor essential to the embodiments unless explicitly described as such.Also, as used herein, the article “a” is intended to include one or moreitems.

All United States patents and applications, foreign patents, andpublications discussed above are hereby incorporated herein by referencein their entireties.

INDUSTRIAL APPLICABILITY

To solve the aforementioned problems, the aspects of the embodiments aredirected towards systems, methods, and modes for a dual mode coolingsystem for electronics with limited access to cooling surfaces or ducts.

ALTERNATE EMBODIMENTS

Alternate embodiments may be devised without departing from the spiritor the scope of the different aspects of the embodiments.

What is claimed is:
 1. A dual mode cooling system, comprising:electronic heat generating circuitry; a printed circuit board upon whichthe electronic heat generating circuitry is located on a first side; asubstantially adiabatic enclosure adapted to house the electronic heatgenerating circuitry, printed circuit board and other components of thedual mode cooling system; a finned heat sink adapted to be in thermalcontact with the electronic heat generating circuitry, the finned heatsink comprising a plurality of heat radiating fins; a faceplate adaptedto enclose the substantially adiabatic enclosure and seal thesubstantially adiabatic enclosure against an interior wall, and whereinthe faceplate comprises— a cool air intake port adapted to receive coolair from an area external to the substantially adiabatic enclosure andprovide the cool air to an interior portion of the substantiallyadiabatic enclosure, and a heated air exhaust port adapted to exhaustheated air out of the enclosure into an area external to the enclosure;and a fan adapted to receive cool air from the cool air intake port andblow the cool air through the plurality of heat radiating fins of thefinned heat sink to remove substantially all of the heat generated bythe electronic heat generating circuitry via convection and generateheated air, and wherein the heated air is exhausted through the heatedair exhaust port by the fan, and wherein an active cooling pathcomprises a path of air as it is received from the cool air intake,passes through the fan, over the heated surface, and then is exhaustedfrom the heated air exhaust port, and wherein the heated air exhaustport is separated with respect to the cool air intake port.
 2. The dualmode cooling system according to claim 1, wherein the heated air exhaustport is cater cornered with respect to the cool air intake port.
 3. Thedual mode cooling system according to claim 1, further comprising: afirst passive cooling path, comprising: a first heat conducting deviceadapted to be in thermal contact with the electronic heat generatingcircuitry and to accept heat generated by the electronic heat generatingcircuitry; and a second heat conducting device adopted to be in thermalcontact with the first heat conducting device and to accept heatconducted from the first heat conducting device and is further adaptedto be compressible to form a thermal transfer path between two objects,and wherein the faceplate is adapted to be in thermal contact with thesecond heat conducting device and to accept heat conducted from thesecond heat conducting device, and is further adapted to convectivelytransfer received heat from its surface to air surrounding thefaceplate.
 4. The dual mode cooling system according to claim 3, furthercomprising: a second passive cooling path, comprising: electronic heatgenerating circuitry; the printed circuit board (PCB) upon which theelectronic heat generating circuitry is located; one or more throughhole thermal vias located in the PCB that are each adapted to be inthermal contact with the electronic heat generating circuitry and toaccept heat generated by the electronic heat generating circuitry; andthe finned heat sink located on the printed circuit board adjacent tothe vias, and which is adapted to be in thermal contact with the one ormore through hole thermal vias and to accept heat conducted from the oneor more through hole thermal vias.
 5. The dual mode cooling systemaccording to claim 4, further comprising: a third passive cooling path,comprising— the electronic heat generating circuitry; and a fourth heatconducting device adapted to be in thermal contact with the electronicheat generating circuitry and the finned heat sink, and wherein thefourth heat conducting device is adapted to accept heat from theelectronic heat generating circuitry and transfer the heat viaconduction to the finned heat sink.
 6. The dual mode cooling systemaccording to claim 3, wherein the first passive cooling path furthercomprises: a third heat conducting device adapted to be in thermalcontact with the electronic heat generating circuitry and the first heatconducting device, and which is adapted to transfer heat via conductionfrom the electronic heat generating circuitry to the first heatconducting device, and which is further adapted to be compressible toform a thermal transfer path between two devices.
 7. The dual modecooling system according to claim 6, wherein the combination of thepassive cooling paths and active cooling path is adapted to removesubstantially all heat generated by the electronic heat generatingcircuitry from the substantially adiabatic enclosure into an area withinwhich the substantially adiabatic enclosure is located.
 8. The dual modecooling system according to claim 6, wherein the combination of thepassive cooling paths is adapted to transfer heat to and through thefaceplate in such a manner that following the electronic heat generatingcircuitry being put into an inactive state and the fan being shut off,the active cooling path the faceplate convectively transfers heat awayfrom the interior of the substantially adiabatic enclosure through thefaceplate such that the faceplate remains at a temperature below anunsafe temperature.
 9. The dual mode cooling system according to claim8, wherein the convective transfer of heat away from the faceplate andinterior of the substantially adiabatic enclosure is such that thefaceplate remains at a temperature below an unsafe temperature occursthrough the conductive transfer of heat to a first area of thefaceplate.
 10. The dual mode cooling system according to claim 9,wherein the unsafe temperature is about 70° C.
 11. The dual mode coolingsystem according to claim 1, further comprising: a baffle wall thatseparates an interior of the substantially adiabatic enclosure into acool air baffle zone and a heated air baffle zone, such thatsubstantially only cool air is located in the cool air baffle zone andsubstantially only heated air is located in the heated air baffle zone.12. The dual mode cooling system according to claim 11, furthercomprising: at least one or more holes in the printed circuit board thatallow cool air to flow from one side of the printed circuit board to theother side of the printed circuit board in the cool air baffle zone; andat least one or more holes in the printed circuit board that allowheated air to flow from one side of the printed circuit board to theother side of the printed circuit board in the heated air baffle zone.13. The dual mode cooling system according to claim 1, wherein thefaceplate comprises: at least one audio video signal connector.
 14. Thedual mode cooling system according to claim 1, wherein the electronicheat generating circuitry comprises: audio-video processing circuitry.15. The dual mode cooling system according to claim 1, wherein thesubstantially adiabatic enclosure comprises: a standard gang box or wallmounted enclosure.
 16. The dual mode cooling system according to claim15, wherein the standard gang box can be located within an insulatedwall.
 17. The dual mode cooling system according to claim 1, furthercomprising: one or more through hole thermal vias located in the printedcircuit board that are each adapted to be in thermal contact with theelectronic heat generating circuitry and to accept heat generated by theelectronic heat generating circuitry and to transfer the same to thefinned heat sink, the finned heat sink located on a second side of theprinted circuit board.
 18. The dual mode cooling system according toclaim 1, wherein the cool air intake port comprises— one or more holesin the faceplate formed at an angle α with respect to a first imaginaryline that is formed perpendicular to an outer surface of the faceplate,such that the cool intake air is ingested into the substantiallyadiabatic enclosure from a first direction, and wherein the heated airexhaust port comprises— one or more holes in the faceplate formed at anangle β with respect to a second imaginary line that is formedperpendicular to the outer surface of the faceplate such that the heatedexhaust air is expelled away from the faceplate in a second direction.19. The dual mode cooling system according to claim 18, wherein theangle α and the angle β are each about 0°.
 20. The dual mode coolingsystem according to claim 18, wherein the angle α is an acute angle andthe angle β is about 0°.
 21. The dual mode cooling system according toclaim 18, wherein the cool air intake port formed at the angle α pointsaway from the heated air exhaust port formed at the angle β.
 22. Thedual mode cooling system according to claim 18, wherein the angle α isabout 0° and the angle β is an acute angle.
 23. The dual mode coolingsystem according to claim 18, wherein the angle α is an acute angle andthe angle β is an acute angle.
 24. An audio-video distribution system,comprising: an audio-video encoder adapted to receive at least one highdefinition multimedia interface (HDMI) encoded audio-video (AV) signalvia an HDMI cable, encode the same as an AV-over-internet protocol(AV-over-IP) signal, transmit the AV-over-IP signal to an AVreceiver/splitter, wherein the AV receiver/splitter is adapted toreceive the AV-over-IP signal, split the audio portion from the videoportion of the AV-over-IP signal, convert the video portion back to anHDMI encoded video signal, re-transmit the HDMI encoded video signal toa display that is adapted to display an HDMI encoded video signal, andre-transmit the audio portion to one or more loudspeakers, and whereinthe audio-video encoder comprises— electronic heat generating circuitry;a printed circuit board upon which the electronic heat generatingcircuitry is located on a first side; a substantially adiabaticenclosure adapted to house the electronic heat generating circuitry,printed circuit board and other components of the dual mode coolingsystem; a finned heat sink adapted to be in thermal contact with theelectronic heat generating circuitry, the finned heat sink comprising aplurality of heat radiating fins; a faceplate adapted to enclose thesubstantially adiabatic enclosure and seal the substantially adiabaticenclosure against an interior wall, and wherein the faceplate comprises—a cool air intake port adapted to receive cool air from an area externalto the substantially adiabatic enclosure and provide the cool air to aninterior portion of the substantially adiabatic enclosure, and a heatedair exhaust port adapted to exhaust heated air out of the enclosure intoan area external to the enclosure; and a fan adapted to receive cool airfrom the cool air intake port and blow the cool air through theplurality of heat radiating fins of the finned heat sink to removesubstantially all of the heat generated by the electronic heatgenerating circuitry via convection and generate heated air, and whereinthe heated air is exhausted through the heated air exhaust port by thefan, and wherein an active cooling path comprises a path of air as it isreceived from the cool air intake, passes through the fan, over theheated surface, and then is exhausted from the heated air exhaust port,and wherein the heated air exhaust port is separated with respect to thecool air intake port.